Non-contact radiant heating and temperature sensing device for a chemical reaction chamber

ABSTRACT

An apparatus and methods are provided for heating and sensing the temperature of a chemical reaction chamber without direct physical contact between a heating device and the reaction chamber, or between a temperature sensor and the reaction chamber. A plurality of chemical reaction chambers can simultaneously or sequentially be heated independently and monitored separately.

CROSS REFERENCE TO RELATED APPLICATION

[0001] The present application claims a benefit under 35 U.S.C. §119(e)from earlier filed U.S. Provisional Patent Application No. 60/382,502,filed May 22, 2002, which is incorporated herein in its entirety byreference.

FIELD

[0002] The present invention relates to an apparatus and method forheating and sensing the temperature of a chemical reaction chamber.

BACKGROUND

[0003] Temperature control is a common requirement for biochemicalreactions. Conventional temperature control designs typically requiresome form of contact (e.g., physical engagement) or interconnection(e.g., electrical connectors) between an instrument and one or morediscrete reaction devices to perform the temperature control functions.

[0004] Such contact or interconnection, however, is not always practicalor desirable. For various purposes, a non-contact radiant heating andtemperature sensing device for a chemical reaction chamber may bedesirable.

[0005] All patents, applications, and publications mentioned here andthroughout the application are incorporated in their entireties byreference herein and form a part of the present application.

SUMMARY

[0006] Various embodiments provide a system that includes a non-contactradiant heater and a non-contact temperature sensor for a chemical orbiochemical reaction chamber. The heater can be designed to emitradiation having a wavelength of, for example, about 0.7 micrometer orlonger, or about 1.5 micrometers or longer. The heater can be, forexample, a laser source or a halogen light source. The sensor can detectradiant energy emitted from the reaction chamber without contacting thereaction chamber. According to various embodiments, the sensor candetect radiant energy having a wavelength of from about two micrometersto about 20 micrometers, for example, a wavelength of from about fivemicrometers to about 15 micrometers. The sensor can be, for example, anon-contact infrared pyrometer.

[0007] According to various embodiments, a non-contact heating andtemperature sensing system is provided for regulating temperature withina chemical reaction chamber. The reaction chamber can be formed in asubstrate or can be fixed, secured, mounted, or otherwise attached orconnected to a surface of a substrate or to a holder.

[0008] According to various embodiments, a method is provided whereby anon-contact radiant energy source is used to heat a reaction region toeffect or promote a chemical and/or biochemical reaction. The reactionregion can be within an analytical instrument such as a polymerase chainreaction (PCR) device, a medical diagnostic device, a DNA purificationinstrument, a protein or blood gas analyzer, or other instrument. Theenergy source can be designed to emit energy having a wavelengthsufficient to carry out a desired reaction or desired reaction rate. Forexample, according to various embodiments, the energy source emitsenergy having a wavelength of at least about 0.7 micrometer.

[0009] It is to be understood that both the foregoing description andthe following description are exemplary and explanatory only, and arenot limiting.

BRIEF DESCRIPTION OF THE DRAWINGS

[0010]FIG. 1 is a schematic view of a radiant heater, biochemicalreaction chamber, and radiant temperature sensor according to variousembodiments;

[0011]FIG. 2 is a schematic drawing of a radiant heater, biochemicalreaction chamber, radiant temperature sensor, and control systemaccording to various embodiments;

[0012]FIG. 3 is a cross-sectional view of a biochemical reaction chamberformed in a device substrate and having an aluminum film cover,according to various embodiments;

[0013]FIG. 4 is a cross-sectional view of a biochemical reaction chamberformed in a device substrate and having a transparent film cover,according to various embodiments;

[0014]FIG. 5 is a cross-sectional view of a biochemical reaction chamberformed in a device substrate and having a transparent film cover on bothsides of the device, according to various embodiments; and

[0015]FIG. 6 is a perspective exploded view of a rotating non-contactheating and temperature-sensing system according to various embodiments.

DESCRIPTION OF VARIOUS EMBODIMENTS

[0016] When energy is radiated from an object, the radiated energy canbe used according to various embodiments to make a determination of thetemperature of the object. The energy can be in the visible lightspectrum or in the non-visible light spectrum. As the energy strikes adetector in a sensor, a reaction occurs that can result in an electricalsignal output from the detector. The electrical output can be a signalthat can be processed, for example, amplified and/or linearized, asdesired, to calculate temperature according to common pyrometertechniques.

[0017] Some applicable circuits, signal processing systems, temperaturesensors, heaters, and related devices that can be useful in constructinga system according to various embodiments are described in U.S. Pat.Nos. 4,632,908; 5,232,667; 5,653,537; 5,882,903; 5,539,673; and6,022,141, which are incorporated herein in their entireties byreference.

[0018] According to various embodiments, a heating andtemperature-sensing system is provided, for example, as shown in FIG. 1.The system of FIG. 1 includes a first platform, first platform region,or radiant heater platform 30 that includes a heater support 32supporting a non-contact radiant heater 10. The non-contact radiantheater 10 can emit radiant energy 11 in a direction toward a chemicalreaction chamber 12. The reaction chamber 12 can be an individualchamber defined by sidewalls 13 or can be formed in a substrate of anassembly or device (not shown in FIG. 1). The reaction chamber 12 can besupported by a device support 50 that can include a holding feature suchas, for example, a recess 52 as shown, for receiving and supporting thereaction chamber 12 for heating the reaction chamber 12. The holdingfeature instead or additionally includes a clamp, a threaded rod orthreaded hole, a magnetic attachment device, a suction or vacuum holdingdevice, a snap-fit connection, a recess in a spinnable platen, or anyother holding feature that would be apparent to one skilled in the art.The system can further include a second platform or second platformregion 40 having a support 42 for supporting a non-contact radianttemperature sensor 14. Radiant energy 15 emitted from the heatedreaction chamber 12 radiates at least in a direction toward thenon-contact temperature sensor 14 and is detected by the temperaturesensor 14.

[0019] According to various embodiments of the present invention, theradiant heater 10 can heat the reaction chamber 12 without physicallycontacting the reaction chamber 12 or a reaction mixture in the reactionchamber 12. The temperature sensor 14 can sense the temperature of thereaction chamber 12 and/or the contents of the reaction chamber 12 viaradiant energy emissions without contacting the reaction chamber 12.

[0020] The radiant heater 10 can be spaced away from the reactionchamber 12 by a distance of, for example, from about one millimeter toabout 10 cm, or more. The radiant heater 10 can be spaced away from thereaction chamber 12 a distance of at least about two millimeters, forexample, a distance of from about five millimeters to about 20 mm awayfrom the reaction chamber 12.

[0021] The temperature sensor 14 can be spaced away from the reactionchamber 12 by a distance of, for example, from about one millimeter toabout 10 cm, or more. The temperature sensor 14 can be spaced away fromthe reaction chamber 12 a distance of at least about two millimeters,for example, a distance of from about five millimeters to about 20 mmaway from the reaction chamber 12.

[0022] The distance of the radiant heater 10 from the reaction chamber12 can be the same as, or different than, the distance of thetemperature sensor 14 from the reaction chamber 12.

[0023] The device support 50, non-contact radiant heater support 32, andthe temperature sensor support 42, can be commonly secured, mounted,affixed, or otherwise attached to a common structure, such as thehousing for a work station. Exemplary work stations that can includevarious supports, whether or not directly or indirectly mounted to thework station housing, include devices to carry out PCR. Other exemplarywork stations or platforms that can be used or adopted for use include,for example, devices to heat-treat a heat-curable material such as gluedisposed between components of an assembly, and other instruments thatrequire heating.

[0024] The reaction chamber 12 can be adapted to hold samples, forexample, fluids that can include, for example, polynucleotide primers,polynucleotide probes, nucleic acids, deoxyribonucleic acids,dideoxyribonucleic acids, ribonucleic acids, peptide nucleic acids,individual polynucleotides, buffers, other ingredients known or used inconjunction with PCR techniques, and combinations thereof. The reactionchamber 12 can be sealed sufficiently to prevent or minimize evaporationand contamination of a liquid sample, such as a PCR fluid, disposed inthe reaction chamber.

[0025] Herein, the “chemical reaction chamber” and “reaction chamber”can include, for example, any chamber, vessel, container, sample well,purification tray, microtiter tray, capsule, sample array, centrifugetube, or other containing, retaining, restraining, or confining device,without limitation, that is able to retain one or more chemicals orbiochemicals for a reaction thereof. The reaction chamber can be formedin a substrate or can be fixed, secured, mounted, or otherwise attachedor connected to a surface of a substrate or to a holder.

[0026] The reaction chamber can have a cylindrical shape, a cubicalshape, a rectangular shape, a parallelepiped shape, or any other shape.The reaction chamber can comprise a reaction chamber in amicroanalytical device such as a card-type assay device. The volume ofthe reaction chamber can be, for example, from about 1 μl to about 10ml, from about 0.1 μl to about 1 ml, from about 0.1 μl to about 100 μl,or from about 0.1 μl to about 10 μl.

[0027] The reaction chamber can have at least one dimension of about 600μm or less, for example, a reaction chamber having at least onedimension of about 500 μm or less, or of about 400 μm or less, or ofabout 300 μm or less. For example, the reaction chamber can becylindrical in shape, can have a diameter of from about 0.5 mm to about3.0 mm, for example, from about 1.0 mm to about 2.0 mm, and a depth offrom about 100 μm to about 600 μm, for example, from about 200 μm toabout 500 μm.

[0028] According to various embodiments, the system can include aplurality of non-contact radiant heaters, a plurality of non-contacttemperature sensors, or a plurality of both. One reaction chamber can beheated and temperature-sensed according to various embodiments of thepresent invention, or a plurality of reaction chambers can be heatedsimultaneously or sequentially and/or sensed simultaneously orsequentially.

[0029] The temperature range of the radiant heating device according tovarious embodiments can be from about 20° C. up to and including about100° C., and can encompass the typical temperature ranges needed forconventional biochemical reactions, for example, temperatures desirablefor PCR reactions, for example, between about 60° C. and about 95° C.

[0030] The radiant heating source according to various embodiments canoperate to generate radiation in the infrared or near infrared region ofthe electromagnetic radiation spectrum, for example, wavelengths ofequal to or greater than about 0.5 micrometer, for example, equal to orgreater than about 0.7 micrometer. The temperature sensor device of thepresent invention can, according to various embodiments, detecttemperatures in the infrared region of the electromagnetic radiationspectrum, that is, radiant energy of wavelengths of at least about fivemicrometers, for example, from about five micrometers to about 15micrometers.

[0031] According to various embodiments, the radiant heater can comprisea laser source, a halogen bulb, a lamp heater, and/or a photon or lightsource heater that emits radiation having a wavelength of at least about0.5 micrometer or greater, for example, at least about 0.7 micrometer.The radiant heater can unidirectionally emit a radiation beam toward thereaction chamber. According to such embodiments, the unidirectionalemission avoids wasting energy due to emissions in directions not towardthe reaction chamber.

[0032] The temperature sensor, according to various embodiments, can bea thermopile and/or any other suitable optical temperature-sensingdevice.

[0033]FIG. 2 shows a temperature control system according to variousembodiments of the present invention that can be used to carry outmethods according to various embodiments. FIG. 2 shows a non-contactradiant heater 10, a chemical reaction chamber 12, a temperature sensor14, and a temperature control system 16. Also shown in FIG. 2 is acontrol mechanism 18 that is adapted to measure the actual temperature(T_(actual)) detected from the reaction chamber, for example, in degreesCentigrade (° C.), and is adapted to respond to a signal for a desiredor target temperature (T_(target)), for example, in degrees Centigrade.

[0034] According to various embodiments, the control unit 18 can be, forexample, a CPU or other processor or microprocessor. The control unitcan be adapted to determine, based on detector responses received fromthe temperature sensor, and/or in combination with the temperaturesensor, the temperature of the reaction chamber. The reaction chambertemperature can be determined from radiant energy exiting the reactionchamber through, for example, a transparent film or transparent wallthat at least partially defines the reaction chamber. The temperature ofthe reaction chamber can be determined from a measured radiant energyradiating from a black or opaque film, or a black or opaque wall, thatat least partially defines the reaction chamber. The control unit 18 canreceive a signal from the temperature sensor indicating the temperatureof the reaction chamber, and optionally can also record the temperaturedetected. The control unit 18 can be a computer (e.g., a programmedgeneral computer, or a special purpose computer) or a microprocessoradapted to send a command to the radiant heater to begin, increase,maintain, decrease, or end the radiant heat emission or output of theradiant heater. The control unit 18 can therefore be provided with amicroprocessor on which, or within which, is embedded a software programfor receiving and/or responding to signals or to pre-set conditions fortemperature maintenance. The radiant heater can be adapted or controlledwith the control unit to receive signals from the control unit 18, andrespond accordingly to begin, increase, maintain, decrease, or end theheat energy output.

[0035] According to various embodiments, the control unit 18 can alsoinclude a timer or a timekeeping program, or can be used in conjunctionwith a timer or a time-keeping program. The control unit 18 can beprogrammed to control the radiant output of the non-contact radiantheater based on a signal provided by the temperature sensor, the timer,the time-keeping program, or a combination thereof.

[0036]FIG. 3 shows a system according to various embodiments thatincludes a chemical reaction chamber 12 having a length “a” that can befrom about one micrometer up to and exceeding one centimeter, forexample, from about one to about two millimeters. The dimension “a” canbe a diameter if the reaction chamber is round, or a length if thereaction chamber is linear, square, rectangular, or the like. As in theembodiment of FIG. 1, the reaction chamber 12 can be formed in asubstrate 20 of an assembly 21.

[0037] According to various embodiments, materials useful for theassembly of substrate 20 include those having structures and/orcomprised of materials that together provide a low thermal conductivity,for example, structures including a reaction chamber width (or diameter)to sidewall depth ratio of greater than 1:1, and materials having athermal conductivity of below about 1.0 W/m° C. Materials that can beused for the substrate include, for example, polycarbonate, otherplastics, glass, other thermally resistant materials, and combinationsthereof.

[0038] According to various embodiments, the reaction chamber 12 can beclosed on the top by a thin cover 22. The cover 22 can be rigid orflexible. The cover 22 can be optically transparent, translucent, oropaque, for example, black in color. In various embodiments wherein thereaction chamber is at least partially defined by a cover, the cover canhave, for example, a high thermal conductivity, e.g., a thermalconductivity of greater than about 1.0 W/m° C., and an emissivity ofabout 0.1 or higher, for example, about 0.5 or higher, on a scale offrom zero to one. Such materials can include, for example, an aluminumfilm blackened on the top by anodizing, painting, or some other coatingmaterial or technique, or a thin black plastic film such as a pigmentedpolycarbonate. Because black-anodized aluminium has a high thermalconductivity (e.g., 1.0 W/m° C. or greater), it can be used as a thin orthick film cover, for example, as a film cover having a thickness offrom about 0.01 mm to about 1.0 mm or greater. A rigid plate, forexample, made of pigmented polycarbonate, can be used as the cover 22.Materials of low thermal conductivity (e.g., less than 1 W/m° C.) can beused as thin film covers provided they are thin enough to exhibit asuitable thermal conductivity, for example, an optically transparentpolycarbonate film having a thickness of from about 0.01 mm to about 1.0mm, for example, a thickness of from about 0.01 mm to about 0.5 mm.

[0039] Radiant energy can be used to heat the chemical materials byconduction through the cover 22 or by transmission of radiant energythrough the cover in situations where, for example, the cover comprisesan optically transparent or optically translucent material. Black oropaque covers that absorb heat from the non-contact radiant heater canbe used and can heat-up and conduct heat to components in a reactionchamber at least partially defined by the cover. The bottom surface 23of the cover 22 can be in direct contact with a reaction liquid ormaterials in the reaction chamber 12.

[0040] In the embodiment shown in FIG. 3, the radiant energy source 10can emit radiation toward cover 22. In various embodiments, the cover 22can be black or opaque and can absorb heat from the non-contact radiantheater, then conduct the heat to the underlying or adjacent reactionchamber and components therein. In various embodiments, the cover 22 canbe optically transparent or optically translucent and can transmit heatradiated from the non-contact radiant heater through the cover 22, andheat the reaction chamber or components therein without the need toconduct heat from the cover 22 into the reaction chamber. In variousembodiments, the cover 22 is removed or absent and the radiation fromthe radiant energy heating source 10 strikes and heats directly thechemical materials in the reaction chamber 12, or strikes and heats thedesired materials after passing through a transparent, nonheat-absorbing film or other cover. According to various embodiments,there is no direct physical contact between the radiant energy heatingsource 10 and either the reacting materials in reaction chamber 12 orthe cover film 22.

[0041] The temperature sensor 14 shown in FIG. 3 can operate on the sameside of the substrate 20 as the heating source 10, as shown. The sensorcan sense or detect the temperature of the cover 22 that in turn isabout the same as, or correlates in a known manner to, the temperaturein the interior of the reaction chamber 12.

[0042]FIG. 4 shows another embodiment, including an assembly 121 havinga reaction chamber 112 similar to the chamber 12 shown in FIG. 3. Theassembly 121 includes a thin transparent film cover 123. The film cover123 can include a transparent film, for example, of polycarbonate,polyethylene, polyester, polypropylene, other plastics, copolymers,composites thereof, combinations thereof, and the like. According to theembodiment of FIG. 4, radiant energy passes through the transparentcover film 123 from a radiant heater 10 to heat reacting materialcontained beneath the cover 123 and within the reaction chamber 112 insubstrate 120. A temperature sensor 14 detects radiation emitted fromthe reaction chamber 112 that radiates outwardly through the cover 123.The cover film 123 can, according to various embodiments, be of anysuitable thickness, for example, less than or equal to 2.0 mm, or lessthan 1.0 mm. According to various embodiments wherein the cover 123 isoptically transparent or optically translucent, the cover can exhibit anemissivity high enough to transmit radiant heat indicative of thetemperature of the reaction chamber from the reaction chamber toward thenon-contact radiant temperature sensor.

[0043] According to various embodiments wherein the cover 123 is blackor opaque, the cover can exhibit an emissivity high enough to absorbheat from the reaction chamber and, in turn, radiate heat indicative ofthe temperature of the reaction chamber toward the non-contact radianttemperature sensor. The cover 123 can have an emissivity of about 0.1 orhigher, for example, about 0.5 or higher, or 0.75 or higher, on a scaleof from zero to one. Such materials can include, for example, analuminum film blackened on the top by anodizing, painting, or some othercoating material or technique, or a thin black plastic film such as apigmented polycarbonate.

[0044]FIG. 5 is a cross-sectional view of an assembly 221 including achemical reaction chamber 212 having a film cover 222 and a film cover223. The materials for covers 222 and 223 can be, for example, opticallytransparent, optically translucent, opaque, black, or a combinationthereof, as described in connection with FIGS. 3 and 4. The film cover222 can be, for example, an optically transparent or opticallytranslucent film on the top side 224 of the substrate 220, and the filmcover 223 can be, for example, an opaque or black film cover 223 on abottom side 226 of the substrate 220. FIG. 5 depicts the chemicalreaction chamber 212 as a through-hole 228 in the substrate 220. Thethrough-hole 228 is sealed with the covers 222 and 223. The radiantheater 10 and temperature sensor 14 can be placed on opposite sides ofthe assembly 221 and can be located at different positions of thereaction chamber. According to various embodiments, the radiant heater10 and the temperature sensor 14 are coaxially aligned and in use can beused in an alternating manner such that the temperature sensor can sensethe temperature of the reaction chamber while the non-contact radiantheater is not heating the reaction chamber.

[0045] As shown in FIG. 5, the non-contact temperature sensor 14receives radiant energy from directions encompassed by a line of sightor field of view 250. According to various embodiments, the field ofview 250 of the non-contact radiant temperature sensor 14 can divergeconically toward the reaction chamber 212 and intersect with a firstsurface 230 of film cover 223 in an area having a diameter D referred toherein as the field of view viewing area. The field of view canintersect the reaction chamber or an outer wall thereof in a viewingarea having a shape other than circular, but having a diameter. Tominimize background radiation that can affect or distort the temperaturesensed by non-contact temperature sensor 14, the periphery of the fieldof view of the sensor can be wholly encompassed by a surface. Forexample, the periphery of the field of view can (e.g., an outer surface)of the reaction chamber being sensed. For example, the periphery of thefield of view can fall wholly on a portion of a film cover surface thatdefines the reaction chamber, as shown in FIG. 5.

[0046] The field of view viewing area at the surface of the reactionchamber can be smaller than the area of the reaction chamber wall orsurface being temperature-sensed. The field of view viewing area canwholly fall within a corresponding reaction chamber or reaction chambersurface having an optically transparent or optically translucent filmcover that is adjacent the reaction chamber. The field of view viewingarea can have an area that is larger, smaller, or the same area as thearea of a corresponding reaction chamber surface or reaction chamberfilm cover surface to be temperature-sensed. The ratio of the field ofview viewing area to the reaction chamber surface area can be from about2:1 to about 1:20, for example, from about 1:10 to about 9:10, fromabout 1:6 to about 1:2, or from about 1:5 to about 1:3. The field ofview viewing area can have a diameter or smallest dimension, forexample, of from about 0.1 mm to about 10 mm or greater, for example, adiameter or smallest dimension of from about 0.5 mm to about 5 mm, orfrom about 1.0 mm to about 2.0 mm. Exemplary non-contact radiant heatersthat can be used according to various embodiments include thosedescribed in U.S. Pat. Nos. 5,232,667 and 6,367,972, which areincorporated herein in their entireties by reference. Exemplary sensorsthat can be used include infrared sensors having a focused line ofsight.

[0047] According to various embodiments, the reaction chamber can bewithin a device that is covered with a cover, such as, but not limitedto, a metal cover. Exemplary metal covers for the reaction chamberinclude a black aluminum cover that can receive radiant energy from theradiant heater, according to various embodiments.

[0048] In various embodiments, the reaction chamber can be in a devicethat is covered, at least in part, with a transparent film. Thin films,such as films of 0.1 mm thickness or less, are useful as covers for thereaction chamber of various embodiments. Such a thin film can comprise,but is not limited to, a plastic such as polycarbonate, or any othermaterial optically transparent to a wavelength, that is, which transmitsabout 100% of the energy of the wavelength desired for heating reactantsin the chemical reaction chamber.

[0049] The assembly designs depicted in FIGS. 3-5 can accommodate,according to various embodiments, two or more chemical reactionchambers. Heating and temperature sensing of a plurality of chemicalreaction chambers together can be accomplished by various embodiments.Each reaction chamber of a plurality of reaction chambers can be movedin turn under a single non-contact radiant heater, or can be alignedwith a respective non-contact radiant heater. Each reaction chamber of aplurality of reaction chambers can be lined up with atemperature-sensing device, or each reaction chamber of a plurality ofreaction chambers can be lined-up with a respective temperature sensor.According to various embodiments, a plurality of reaction chambers canbe arranged in a heatable device, for example, a microfluidic analyticaldevice such as a microcard device, and together rotated about an axis ofrotation central to the heatable device or a platform holding thedevice. An example of such a device is shown in FIG. 6.

[0050] In various embodiments, a non-contact radiant heating andtemperature-sensing system 590 is provided, as shown in FIG. 6. Thesystem 590 can include a rotatable heating assembly 600. Any number ofindividual non-contact radiant heaters 602 can be mounted, fixed,connected, attached, or otherwise supported by or secured to the heaterassembly 600. The heater assembly 600 can be rotated about an axis ofrotation 601 on a shaft 604. An appropriate motor and drive system canbe provided to rotate the shaft 604 and corresponding heater assembly600 as desired. Appropriate circuitry and electronics can be provided toselectively activate one or more of the individual heaters 602 of theheater assembly 600 and/or to coordinate a sequence of activations ofthe various heaters. In FIG. 6, non-contact radiant heater 602′ is theonly heater of the heater assembly 600 that is shown emitting radiantheat 606 in the drawing. Radiant heat 606 can be directed, for example,by rotation of heater assembly 600, so as to radiate, for example,linearly, toward a reaction chamber 622′.

[0051] Reaction chamber 622′ can be one of a plurality of reactionchambers 622 in a reaction chamber assembly 620. Although the heaterassembly 600 can be spaced-apart from the reaction chamber assembly 620in the proportions shown in FIG. 6, FIG. 6 is an exploded view of thesystem 590, and the distance between heater 602′ and reaction chamber622′ can be from about 0.1 mm to about 100 mm, for example, from about 1mm to about 30 mm, or from about 5 mm to about 20 mm. Reaction chamberassembly 620 can be supported for rotation about axis of rotation 601 bya support device 630 that can include a support arm 632, a motor, andtransmission components (not shown) to rotate the reaction chamberassembly 620. Motor and transmission components can be provided thatrotate the reaction chamber assembly 620 to position one or more of thereaction chambers 622 with respect to one or more of the non-contactradiant heaters 602, and/or to spin the reaction chamber assembly 620 atrpms sufficient to effect a centripetal manipulation of a sample in areaction chamber. The reaction chamber assembly can be spun at speeds of100 rpm or greater, for example, speeds of 1000 rpm or greater, 3000 rpmor greater, or 5000 rpm or greater.

[0052] According to various embodiments, a heated reaction chamber 622″can be temperature-sensed by a non-contact radiant temperature sensor610′ at the same time that the non-contact radiant heater 602′ heatsreaction chamber 622′. Non-contact radiant heater 602′ can be activatedat the same time that sensor 610′ is activated so that heat fromreaction chamber 622′ does not distort sensing of temperature by sensor610′. Non-contact radiant temperature sensor 610′ can be one of manytemperature sensors 610 commonly supported, mounted, connected,attached, or otherwise affixed or secured to a temperature-sensingassembly 608. Although the temperature-sensing assembly 608 can bespaced-apart from the reaction chamber assembly 620 in the proportionsshown in FIG. 6, FIG. 6 is an exploded view of the system 590. Thetemperature-sensing assembly 608 can be spaced, for example, from about0.1 mm to about 100 mm away from the reaction chamber assembly 620, forexample, from about 1 mm to about 30 mm, or from about 5 mm to about 20mm away from the reaction chamber assembly 620. Temperature-sensingassembly 608 can be rotated about the axis of rotation 601 by a motorand transmission system that rotates a shaft 612 attached to thetemperature-sensing assembly 608 for rotation of the same.

[0053] Each of the heater assembly 600, reaction chamber assembly 620,and temperature sensing assembly 608 can independently be stationary orrotatable. For example, one or more of these three assemblies or allthree assemblies, can be rotated about an axis of rotation 601 to effectany of various alignments of the non-contact radiant heaters 602 and/orthe non-contact temperature sensors 610 with the various reactionchambers 622. One or more of the heater assembly 600, reaction chamberassembly 620, and temperature sensing assembly 608 can be provided witha rotatable platform so that one or more of the heater assembly 600,reaction chamber assembly 620, and temperature sensing assembly 608 canbe rotated individually or jointly about axis of rotation 601, as shown.One or more of the heater assembly 600, reaction chamber assembly 620,and temperature sensing assembly 608 can be stationarily supported on,for example, a platform or a support, for example, shaft 604 as shown inFIG. 6. A control system can be included to activate one or more of thenon-contact radiant heaters 602 in response to a signal providedindicative of one or more temperatures of one or more of the reactionchambers 622. A plurality of the non-contact radiant heaters can beactivated sequentially or simultaneously in response to detectedtemperatures of a corresponding plurality of reaction chambers 622.

[0054] According to various embodiments such as shown in FIG. 6, thesystem can heat and control the temperatures of the plurality ofchemical reaction chambers individually. The plurality of reactionchambers can be individually cooled, or cooled together by any of avariety of cooling apparatus and methods. For example, cool or ambientair or fluid can be directed toward the reaction chambers, a cooling fancan be provided to blow a cooling fluid at the reaction chambers, thereaction chambers can be spun and cooled by the spinning action inambient or cool air, the reaction chambers can be immersed in a coolingliquid, the reaction chambers can cooled by conduction against a coolingsurface, or any other suitable cooling device or cooling method can beused. Such a design also allows each reaction chamber to be monitoredindividually. An assembly can be provided, according to variousembodiments, wherein a separate radiant heater and a separate heatsensor are provided for each of a plurality of reaction chambers. Theradiant heater can be position mounted on a static or on a movableplatform. The heat sensor can be position mounted on a static or amovable platform.

[0055] In embodiments such as those shown in FIGS. 3-5, and whereinmultiple heaters and sensors are used, the radiant or optical heatingsources 10 and the temperature sensors 14 can be operated eithersimultaneously or alternately. Alternate operation of the heater 10 andsensor 14 can be used to reduce detection by the sensor of radiationthat might be reflected by a cover in embodiments where a non-contactradiant heater and a non-contact temperature sensor are used on the sameside of a reaction chamber. Alternate heating and temperature sensingcan also reduce or eliminate the sensing of radiant heat emanating fromthe non-contact radiant heater and not from the reaction chamber.

[0056] According to various embodiments, method of non-contact heatingand temperature sensing are provided for conducting a chemical reaction.For example, the method can involve (i) directing radiation towards areaction mixture from a radiant heating source spaced away from thereaction mixture; (ii) detecting radiation emanating from the reactionmixture, and (iii) determining the temperature of the reaction mixturebased on the detected radiation. The method can include directingradiation toward a reaction mixture in a reaction chamber having avolume of less than about 10 ml, for example, having a volume of fromabout 1.0 μl to about 10 μl. The method can include detecting radiationwith a temperature sensor having a field of view viewing area diameterof from about 0.1 mm to about 10 mm, for example, of from about 1.0 mmto about 2.0 mm. The method can include directing radiation toward areaction mixture in a reaction chamber having at least one dimension ofabout 600 μm or less, for example, a reaction chamber having at leastone dimension of about 500 μm or less, of about 400 μm or less, or ofabout 300 μm or less.

[0057] According to various embodiments, a method can be provided thatcan include providing a non-contact heating and temperature sensingsystem for a chemical reaction chamber, wherein the system can include:i) a source of radiant energy that emits radiation having a wavelengthof at least about 0.7 micrometer; ii) a temperature sensor able todetect radiant energy without contacting the source of the radiantenergy, wherein the sensor can detect a wavelength of at least aboutfive micrometers; and (iii) a chemical reaction chamber arranged toreceive radiant energy emitted from the source and to emit radiantenergy toward the sensor.

[0058] According to various embodiments, the method can includeproviding one or more chemical or biochemical materials in the chemicalreaction chamber, causing the source of radiant energy to emit radiationwith a wavelength of at least about 0.7 micrometer in at least adirection toward the reaction chamber, whereby the emitted radiationdirectly or indirectly irradiates, illuminates, or otherwise heats thechemical or biochemical materials in the chemical reaction chamber, andmeasuring the temperature of the chemical or biochemical materials bydetecting the radiant energy emitted from the chemical or biochemicalmaterials with the temperature sensor.

[0059] According to various embodiments of the present invention, theradiant heating and sensing methods allow two or more chemical reactionchambers to be maintained simultaneously at different temperatures. Thesystem for such a method can include a control unit for controllingvarious heaters and various temperatures simultaneously.

[0060] The radiant heating and temperature sensing is not dependent uponcontact between a chemical reaction device and thermal components. Thenon-contact technique allows a heatable device to be easily moved insidea chemical reaction instrument or system and to be easily removed fromthe instrument or system. The heatable device can also be easilyreplaced after use.

[0061] In other various embodiments, a plurality of reaction chambers isconveyed to and from heating and temperature sensing regions on acontinuous belt or line, such as on a conveyor belt.

[0062] Other embodiments of the present invention will be apparent tothose skilled in the art from consideration of the specification andpractice of the invention disclosed herein. It is intended that thespecification and examples be considered as exemplary only.

What is claimed is:
 1. A heating system comprising: a non-contactradiant heater; a non-contact radiant temperature sensor; and a heatabledevice including a chemical reaction chamber having a volume of about 10ml or less, the heatable device being spaced from the non-contactradiant heater spaced from the non-contact radiant temperature sensor,and positioned for the chemical reaction chamber to receive heatirradiated by the non-contact radiant heater and for the chemicalreaction chamber to radiate heat toward the non-contact radianttemperature sensor.
 2. The heating system of claim 1, further comprisinga first platform region supporting the non-contact radiant heater, and asecond platform region supporting the non-contact radiant temperaturesensor.
 3. The heating system of claim 2, wherein a plurality ofnon-contact radiant heaters are supported by the first platform region;and a plurality of non-contact radiant temperature sensors are supportedby the second platform region.
 4. The heating system of claim 2, whereinthe first platform region and the second platform region are each a partof the same platform.
 5. The heating system of claim 1, wherein theheatable device is spaced away from the non-contact radiant heater by adistance of from about five mm to about 20 mm.
 6. The heating system ofclaim 2, wherein the first platform region also supports the heatabledevice.
 7. The heating system of claim 1, wherein the non-contactradiant heater comprises a laser source.
 8. The heating system of claim1, wherein the non-contact radiant heater comprises a halogen lightsource.
 9. The heating system of claim 1, wherein the non-contactradiant heater produces a light that has a wavelength of about 0.7micrometer or longer.
 10. The heating system of claim 1, wherein thenon-contact radiant heater can heat the heatable device to a temperatureof from about 20° C. to about 100° C.
 11. The heating system of claim 1,wherein the non-contact temperature sensor is capable of detectingenergy having a wavelength of from about five micrometers to about 15micrometers.
 12. The heating system of claim 5, wherein the heatabledevice includes a substrate, and the substrate has a thermalconductivity of below about 1.0 W/m° C.
 13. The heating system of claim5, wherein the heatable device includes a substrate, and the substrateincludes a plastic material.
 14. The heating system of claim 5, whereinthe heatable device further comprises a sample cover including a surfacethat at least partially defines the reaction chamber.
 15. The heatingsystem of claim 14, wherein the sample cover surface defines at leastone sidewall of the reaction chamber.
 16. The heating system of claim14, wherein the heatable device includes two sample covers that defineat least two sidewalls of the reaction chamber.
 17. The heating systemof claim 14, wherein the sample cover has a thermal conductivity ofgreater than about 1.0 W/m° C., and an emissivity of about 0.1 orhigher.
 18. The heating system of claim 14, wherein the sample covercomprises an aluminum film blackened on at least a first side.
 19. Theheating system of claim 18, wherein the aluminum film has been blackenedby anodizing, painting, coating, or any combination thereof.
 20. Theheating system of claim 14, wherein the sample cover comprises apigmented polycarbonate film material.
 21. The heating system of claim1, further comprising a biochemical sample including a nucleic acidsequence in the reaction chamber and sufficient components to enable atleast one cycle of polymerase chain reaction of the nucleic acidsequence.
 22. The heating system of claim 1, further comprising acontrol unit programmed to control the heat irradiated by thenon-contact radiant heater based on a signal generated by thenon-contact radiant temperature sensor.
 23. The heating system of claim1, wherein the heatable device is spaced away from the non-contactradiant temperature sensor by a distance of from about five mm to about20 mm.
 24. The heating system of claim 1, wherein the heatable device isa microfluidic analytical device.
 25. The heating system of claim 1,wherein the reaction chamber has at least one dimension that is lessthan or equal to 500 μm.
 26. The heating system of claim 1, wherein thenon-contact radiant temperature sensor has a field of view that fallswithin a surface of the reaction chamber.
 27. A heating systemcomprising: a non-contact radiant heater; a non-contact radianttemperature sensor; and a heatable device including a chemical reactionchamber, the heatable device being spaced from the non-contact radiantheater a distance of from about five mm to about 20 mm, being spacedfrom the non-contact radiant temperature sensor a distance of from aboutfive to about 20 mm, and positioned for the chemical reaction chamber toreceive heat irradiated by the non-contact radiant heater and for thechemical reaction chamber to radiate heat toward the non-contact radianttemperature sensor.
 28. A heating system comprising: a non-contactradiant heater; a non-contact radiant temperature sensor; and a heatabledevice including a chemical reaction chamber having at least onesample-confining dimension of about 600 μm or less, the heatable devicebeing spaced from the non-contact radiant heater, spaced from thenon-contact radiant temperature sensor, and positioned for the chemicalreaction chamber to receive heat irradiated by the non-contact radiantheater and for the chemical reaction chamber to radiate heat toward thenon-contact radiant temperature sensor.
 29. A heating system comprising:a non-contact radiant heater; a non-contact radiant temperature sensor;and a heatable device including a chemical reaction chamber including asidewall having an outer surface of a first area, the heatable devicebeing spaced from the non-contact radiant heater, spaced from thenon-contact radiant temperature sensor, and positioned for the chemicalreaction chamber to receive heat irradiated by the non-contact radiantheater and for the chemical reaction chamber to radiate heat toward thenon-contact radiant temperature sensor, wherein the non-contact radianttemperature sensor has a field of view that intersects the outer surfaceof the sidewall at a second area that is smaller than the first area.30. A method of heating a biochemical sample comprising: providing aheatable device that includes a reaction chamber retaining a sample, thereaction chamber having a volume of about 10 ml or less; heating thereaction chamber with a non-contact radiant heater spaced from theheatable device; and sensing a temperature of the reaction chamber witha non-contact temperature sensor spaced from the heatable device. 31.The method of claim 30, further comprising the step of adjusting aradiation output of the non-contact radiant heater based on atemperature of the reaction chamber sensed by the non-contacttemperature sensor.
 32. The method of claim 30, wherein the heatabledevice comprises a plurality of reaction chambers, a plurality ofnon-contact radiant heaters are provided, and a plurality of non-contactradiant temperature sensors are provided; and the method includes:heating the plurality of reaction chambers with the plurality ofnon-contact radiant heaters; and sensing temperatures of the pluralityof reaction chambers with the plurality of non-contact radianttemperature sensors.
 33. The method of claim 30, wherein the heatingcomprises heating with laser-produced radiation.
 34. The method of claim30, wherein the heating comprises heating with a halogen light source.35. The method of claim 30, wherein the non-contact radiant heaterproduces radiation having a wavelength of about 0.7 micrometer orlonger.
 36. The method of claim 30, wherein the heating comprisesheating the reaction chamber to a temperature of from about 20° C. toabout 100° C.
 37. The method of claim 30, wherein the sensing comprisessensing radiant energy that has an approximate wavelength of from aboutfive micrometers to about 15 micrometers.
 38. The method of claim 30,wherein the sample comprises a nucleic acid sequence and sufficientcomponents to enable at least one cycle of polymerase chain reaction ofthe nucleic acid sequence, and the method further comprises: cycling thetemperature of the reaction chamber in a manner sufficient to effectpolymerase chain reaction of the nucleic acid sequence.
 39. The methodof claim 38, wherein cycling comprises: heating the reaction chamber toa temperature of about 95° C. with the non-contact radiant heater; andcooling the reaction chamber to a temperature of about 60° C., andmaintaining the temperature at about 60° C.
 40. The method of claim 39,further comprising the step of repeating the heating and cooling of thereaction chamber one or more times.
 41. A method of heating abiochemical sample comprising: providing a heatable device that includesa reaction chamber retaining a sample, the reaction chamber having atleast one sample-confining dimension of about 600 μm or less; heatingthe reaction chamber with a non-contact radiant heater spaced from theheatable device; and sensing a temperature of the reaction chamber witha non-contact temperature sensor spaced from the heatable device.
 42. Amethod of heating a biochemical sample comprising: providing a heatabledevice that includes a reaction chamber retaining a sample; heating thereaction chamber with a non-contact radiant heater spaced from theheatable device a distance of from about five mm to about 20 mm; andsensing a temperature of the reaction chamber with a non-contacttemperature sensor spaced from the heatable device a distance of fromabout five mm to about 20 mm.